Semiconductors are a vital part of almost every electronic device used in the world today, which makes the upkeep and proper maintenance of semiconductors critical to maintaining our modern global lifestyle. DuPont Electronics & Imaging (E&I) scientists and engineers work tirelessly to improve semiconductor technology and find new and more effective ways to help businesses maintain those semiconductors. Among other things, our award-winning E&I Hsinchu site in Taiwan manufactures chemical-mechanical polishing pads for the semiconductors and substrates that enable our laptops, smartphones, televisions, and more.

To ensure the integrity of the product, the colloidal slurry that makes the polishing surface of each pad must be poured continuously into the casting mold, which only casts five molds at a time. After the fifth mold, the product material continues to pour as the next mold is set up. Twenty to thirty individual polishing pads can be skivved from each mold made at Hsinchu.

After hosting a process-improvement workshop to reduce waste, the Hsinchu team developed a solution that allowed them to stop the pouring process right after the fifth mold is completed, without impacting production quality. This improvement has allowed the site to avoid 85% of process waste while also reducing costs associated with raw materials and waste treatment. The Hsinchu site shared these learnings with its sister site in Newark, Delaware, so that they could realize similar operational gains.